THE EFFECT OF INTERFACIAL THERMAL RESISTANCE ON A SUB-INTERFACE CRACK UNDER THERMAL LOADING
This work focus on investigating the thermal fracture behavior of a sub-interface crack on the base of the former work1,in which the bonded materials are assumed to have the same mechanical properties but dissimilar thermal parameters.However,the constituent materials of composites generally are different in both thermal and mechanical performance,the role of mechanical properties of the bonded materials play in the crack thermal fracture may not be simply ignored.Hence this work consider a more general case that the two bonded semi-infinite plates are of both thermally and mechanically difference,in one of which there exists a crack paralleling to the thermally imperfect bonding interface,a remote heat flux is applied.By using an integral transform/integral equation method,the influence of interfacial thermal resistance on the temperature difference along the crack line,the thermal stress intensity factors (TSIFs) and the crack opening/sliding displacements are researched.The results for steel/chrome bi-material combination show that the thermal fracture behavior of the sub-interface crack is significantly influenced by the interracial thermal resistance and the crack-interface distance..
Bi-material system Interracial thermal resistance Temperature difference Stress intensity factor Crack displacement
Jie WANG Si-yuan ZHOU Cun-fa GAO
State Key Laboratory of Mechanics and Control of Mechanical Structures, Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, P.R.China
国际会议
石家庄
英文
306-311
2019-11-01（万方平台首次上网日期，不代表论文的发表时间）