Research on Large Area Soldering Process for Microwave RF Module Based on DOE Method

摘要：

　　The soldering layer between PCB and the substrate is a main way of heat dissipation and ground connection for microwave RF module.Therefore,the void rate of soldering layer,which means the quality of soldering,has a direct relation with the performance and reliability of the RF module.The mechanism of void forming and theoretical ways to decrease the void rate is analyzed.Using DOE method,the effects of solder shape,soldering technique,substrate coating material and fixing way of PCB on the void rate of soldering layer were studied,and then the main factors influencing the void rate were given.

关键词： large area soldering microwave RF module DOE(design of experiments) Taguchi method void rate reliability

作者: Jin Dayuan Xie xin Wan yun

作者单位: Jiangnan Electronic Communication Research Institute Jiaxing,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1-4

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）