Molecular Dynamics Simulation on Grinding Process of Cu-Si and Cu-SiO2 Composite Structures

摘要：

　　The molecular dynamics(MD)simulation was performed for Cu-Si and Cu-SiO2 nano-metric grinding models.The grinding depth and speed were considered to investigate influence of them in grinding.The transformation of the atomic crystal structure of the workpiece during the grinding process was investigated to reveal the material removal mechanism in nano-grinding.The variation of grinding force between the two models was analyzed.The results showed that grinding force was mainly composed of tangential force and normal force.Under the same grinding parameters,the grinding force of the two models changed similarly.

关键词： molecular dynamic wafer thinning composite structure grinding

作者: Yixin Xu Fulong Zhu Miaocao Wang Xiaojian Liu Sheng Liu

作者单位: Institute of Microsystems,School of Mechanical Science and Engineering,Huazhong University of Scienc Institute of Microsystems,School of Mechanical Science and Engineering,Huazhong University of Scienc

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 79-83

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）