Failure Analysis of a Chip Carrier Board

摘要：

　　The author analyzes different micro areas of the chip carrier board with scanning electron microscope(SEM)and X-ray energy dispersive spectrometer(EDS)to find out the reasons why a type of chip is detached from the carrier board and the device does not work properly.The results show that the phenomenon of chip shedding due to the presence of contaminants between the chip and the carrier board.

关键词： chip carrier board shedding contaminants

作者: Xiaoyu Fang Yue Dong

作者单位: School of Electronic Science and Engineering UESTC Chengdu,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 97-99

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）