Research on Vibration Suppression of High-speed IC Packaging Mechanism Based on Cross-Bee PID Algorithm
In the point-to-point high-speed positioning process of the IC packaging mechanism,the nonlinear characteristics of the servo system influence the performance of the servo system to a different extent,which may easily cause resonance of the system and reduce die attach efficiency of the packaging equipment.Based on the above problems,this paper proposes a cross-global artificial bee PID algorithm to suppress mechanical resonance at the load end.Firstly,the reasons of resonance formation and the influence on the servo system are analyzed.Secondly,the modal of the swing arm mechanism in the IC packaging mechanism is analyzed.Finally,the experimental platform is built.The results show that the resonance of the load end is effectively controlled and the positioning efficiency is improved by 9.1%.
IC packaging mechanism cross-artificial bee PID modal analysis resonance suppression
Ye Lezhi Wang Hongtao Wang Haiming Li Desheng
Beijing University of Technology,Beijing 100124,China CETC Beijing Electronic Equipment Co.,Ltd,Beijing 100176,China
国际会议
上海
英文
100-103
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）