Thermal Stress Analysis of BGA Solder Joint Power Load Based on COMSOL

摘要：

　　In this paper,the finite element analysis model of the solder joint of the ball grid array BGA(Ball grid array)is established,and based on the model,the welding point height and the maximum radial dimension of solder joint are studied by the finite element analysis of the power cyclic loading stress and strain of BGA solder joints.The effect of the diameter of the disc and the diameter of the lower pad on the stress and strain of the solder joint.The results show that the stress of solder joint decreases with the increase of weld point height,and decreases with the decrease of maximum radial size.

关键词： BGA solder joint thermal stress power load

作者: Jian-pei Wang Chun-yue Huang Liang-kun Lu He Wei

作者单位: School of Electro-Mechanical Engineering,Guilin University of Electronic Technology,Guilin 541004,Ch School of Electro-Mechanical Engineering,Guilin University of Electronic Technology,guilin,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 104-108

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）