High Mechanical Dual-Interface FSID COB Package Development for 15N 3wheel Test

摘要：

　　Dual-Interface FSID COB(Chip-On-Board)product has been widely applied in banking card.In order to verifying its mechanical performance,there is a 3Wheel test to simulate banking cards use in ATM machine.At present,the specification of 3Wheel is 100cyc pass with a force of 8N.However,it strongly recommended 100cyc pass with higher force of 15N,in latest CQM(June 2015).Existing Dual-Interface FSID COB has 3Wheel lifetime of less than 50cyc,with a force of 15N.In this paper,simulations were performed to explain mechanism of 15N 3Wheel test.It found out largest stress phase and bonding wire stress concentration.Based on this,some solutions were developed to reduce wire stress to meet 15N 3Wheel test by changing package structure,material and assembly process.

关键词： COB 3Wheel bonding wire stress

作者: Haomin Bao Lei Xu Jianfeng Zeng Yonghua Zhou Jonghyun Chae

作者单位: Package Development Group Samsung Semiconductor China RD(SSCR)Suzhou,China Technology Development Group Samsung Semiconductor China RD(SSCR)Suzhou,China Package Technology Dev.Team Samsung Semiconductor China RD(SSCR)Suzhou,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 121-124

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）