Cantilever Gold Ribbon Bonding used in MMCM

摘要：

　　Cantilever gold ribbon bonding technology plays more and more important role in making high current electrical connections in microwave multi-chip modules(MMCM).Cantilever gold ribbon bonding was studied in the paper,the optimal process parameters of cantilever gold ribbon bonding technology were gained using Taguchi method to improve the ribbon bonding reliability.Cantilever gold ribbons with high reliability are obtained by using optimal bonding process parameters.

关键词： MMCM cantilever gold ribbon bonding reliablity

作者: Han Zongjie Jie Le Yan Wei Hu Yongfang Li Xiaoxuan

作者单位: Department of Microsystem The 14th Institute of China Electronics Technology Group Corporation Nanjing,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 125-128

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）