Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints
With nanoparticles(NPs)for enhancement the reliability of solder joints and interconnections is a trending research arena.In this study,Cu NPs prepared by chemical reduction method,were doped into flux and disseminated to the pure Sn solder(initial diameter of 1.4 mm)and iterfaces during reflow at 250 ℃ for 30 s and 90 s.For the experiment,the solder corresponding to flux without NPs content was observed to have the bigger thickness of Cu6Sn5 layer,compare with the specimen treated with flux with nanoparticles.The presence of Cu NPs was observed to hinder the IMC growth.Upon cooling,the oxides formed by Cu NPs altered the screw-dislocation driven growth of prismatic IMCs and thus produced Cu6Sn5 rods with tapered ends.In the sector of microelectronic packaging materials design,the technique of doping the flux with Cu nanoparticles can be utilized to optimally tailor the interfacial IMC layer microstructure and the thickness.
Nanoparticles,Intermetallic compounds,Screw dislocation,Finite element method Solder
Shengyan Shang Anil Kunwar Yanfeng Wang Jinye Yao Haitao Ma Yunpeng Wang
School of Materials Science and Engineering,Dalian University of Technology,116024,Dalian,China School of Mechanical Engineering,Dalian University of Technology,116024,Dalian,China
国际会议
上海
英文
135-140
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）