Effect of Blade dicing parameters on Die Strength
recently,the 3D wafer become increasingly popular for IC packaging to satisfy the needs of low cost,small size,low-profile features and high performance.Wafer manufacturing process which including grinding and dicing has important influence on die quality.In this paper,the influence of dicing parameters,such as spindle speed and feed speed,on die strength were investigated.And the correlation between chipping size and die strength was discussed.Optical microscope and scanning electronic microscope were used to inspect the chipping morphology and chipping size.Die strength was measured by three point bending test.Experimental results shows that spindle speed of 1.125a can achieve the best less-chipping performance and highest die strength of 426.38MPa.Feed speed of 1.4y can achieve the highest die strength of 435.69MPa.Chipping size was proved to have significant influence on die.Stress concentration induced by chipping is discussed.
wafer dicing spindle speed feed speed chipping die strength
Mengyuan Xue Tao Chen Xundi Zhang Liming Gao Ming Li
Institute of Microelectronic Materials & Technology School of Materials Science and Engineering,Shanghai Jiao Tong University Shanghai,200240,P.R.China
国际会议
上海
英文
180-183
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）