The Corrosion Behavior of Au/Al Interface under High Accelerated Stress Test

摘要：

　　Different cure time has significantly impact on the Au/Al interface corrosion behavior during high accelerated stress test(HAST).A detailed IMC evolution of Au/Al wire bonding interface during HAST is discussed in this paper.After 96hrs/144hrs 130℃ and 85%RH HAST,wire pull ball lift fail rate decreased with the increase of cure time.IMC phase at Au/Al interface were characterized by focus ion beam(FIB)/transmission electron microscope(TEM),and three types of Au-Al IMC phases were observed at the Au/Al interface.Longer cure time is favorable to increase the thickness of Au8Al3 phase,which is better to resist corrosion and strengthen interface bonding.Au/Al interface failure mechanism is discussed in this paper.

关键词： Au/Al interface mold time corrosion HAST

作者: Tao Chen Mengyuan Xue Xundi Zhang Liming Gao Ming Li

作者单位: Institute of Microelectronic Materials & Technology School of Materials Science and Engineering,Shanghai Jiao Tong University Shanghai,200240,P.R.China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 184-189

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）