Stress and strain Analysis of LTCC substrate Module based on Microchannel
In this paper,the thermal stress-strain analysis of low-temperature cofired ceramic substrate with microchannel is carried out.Firstly,the finite element analysis model of microchannel LTCC substrate is established,and the thermal stress-strain analysis is carried out.The stress and strain results of LTCC substrate module with three microchannel structures of echo and line type were analyzed by single factor analysis of LTCC substrate with straight row microchannel structure.The length and width of cross section of microchannel were analyzed respectively.Effect of structural parameters of microchannel spacing on stress and strain of substrate modules It provides a theoretical basis for the reliability design of the new cooling micro channel technology.
Low temperature co-fired ceramics microchannel substrate stress and strain
He Wei Chun-yue Huang Liang-kun Lu Jian-pei Wang
School of Electro-Mechanical Engineering,Guilin University of Electronic Technology,guilin,China
国际会议
上海
英文
210-214
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）