Modeling of Equivalent Thermal Conductivity of Power Delivery Network in 3D Packages

摘要：

　　As increased integration density and power dissipation in 3-D structures,temperature constraints have aroused widespread concern in 3-D ICs.Consisting of good thermal conduction material,power delivery networks(PDN)in 3D packages have significant thermal removal capability.In previous work,the thermal capability and models of PDN in 3D packages are simply described.Here,we propose structurally based models to calculate the equivalent thermal conductivities of PDN.For different heat flows,two different calculation methods of equivalent thermal conductivities for the TSV structures are discussed.Combination of the equivalent thermal conductivity of PDN and the finite element method(FEM),a compact and accurate thermal analysis can be carried out.

关键词： power delivery network (PDN) through silicon via (TSV) thermal property Finite element method (FEM)

作者: Weijun Zhu Gang Dong Zheng Mei Junping Zheng Jingrui Chai Dongliang Song

作者单位: School of Microelectronics,Xidian University,Xian,Shaanxi Province,710071,P.R.China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 233-237

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）