Failure Localization on the Open Circuit for a High Density Ceramic Flip-Chip Package after Reliability Test
Ceramic is widely used in high reliability microelectronic packaging as its excellent properties.Generally,failure analysis for ceramic flip-chip structure is more difficult than other traditional types considering its special structure.Interconnection open failures of a flip-chip device in reliability testing were studied,and a test scheme from NDE to DPA was developed.The possibility of internal failure of the substrate was eliminated through TDR test.The failure position was preliminarily determined by X-ray,SAM and optical microanalysis.And finally,the nickel layer was found to be the accurate failure position of the device which was realized through SEM&EDS.The failure analysis method can be used for reference for failure detection and analysis of other ceramic flip-chip packages.
flip-chip failure analysis X-ray SAM SEM&EDS
Li Han Zheng Hongyu Zhang Xiaojun
The 13th Research Institute,CETC,Shijiazhuang,China CETC,Beijing,China
国际会议
上海
英文
247-251
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）