Effect of Ag element on microstructure and mechanical properties of Sn-Bi-xAg solders designed by cluster-plus-glue-atom model
Novel low-temperature lead-free Sn-Bi-xAg solder alloys were designed by cluster-plus-glue-atom(CPGA)model for low-temperature Al-Cu solder technology.The microstructure,melting behavior,wettability,interfacial reaction and mechanical properties of Sn-Bi-xAg solders were investigated.Both Sn-56.93Bi-0.49Ag and Sn-57.02Bi-1.96Ag solders were near-eutectics with a narrow melting temperature range of 138-140 ℃,indicating that the small substitution of Ag atoms in CPGA model had little effect on the melting behavior.The microstructure of bulk solders in Sn-57.02Bi-1.96Ag bulk solder consisted of black Ag3Sn phase,which was little in Sn-56.93Bi-0.49Ag bulk solder.The high Ag content Sn-Bi-xAg solder shows a better wettability on both Al and Cu substrates than that of low Ag content solder.A continuous Ag2Al intermetallic compound(IMC)formed at Sn-57.02Bi-1.96Ag/Al interface,which was favorable for Sn-Bi-xAg soldering the Al substrate,as well as improved the bonding strength of the solder joints.The scallop-like Cu6Sn5 formed at the both Sn-56.93Bi-0.49Ag and Sn-57.02Bi-1.96Ag Sn-Bi-xAg/Cu interface.The shear strength of the 56.93Bi-0.49Ag and Sn-57.02Bi-1.96Ag solder joints is 35.79 Mpa and 30.07 Mpa,respectively.
Lead-free solder low temperature Sn-Bi-Ag mechanical property microstructure cluster-plus-glue-atom (CPGA) model
Jing Ren Mingliang Huang Xudong Yang
Electronic Packaging Materials Laboratory,School of Materials Science & Engineering Dalian University of Technology Dalian,China
国际会议
上海
英文
265-269
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）