Failure Analysis Technology of Lead-free BGA Solder Joints and Relevant Cases

摘要：

　　Ball grid array(BGA)is an interconnect technology that smaller package sizes and lower failure rate,which joints are hidden in the body of the device.It is hard to detect the solder joint defects and analyze the failure.How to effective judge the quality and reliability of BGA solder joints is a difficult problem in electronic manufacturing.In this paper the failure analysis process and methods on lead-free BGA solder joints are introduced mainly.Combined with the typical failure analysis case of lead-free BGA,these analysis technology is introduced in the application of actual case.The failure analysis techniques play an important role on promoting the reliability of lead-free BGA solder joints,which can quickly and accurately find the failure cause.It will lay the foundation for improving the quality of products.

关键词： BGA Failure Analysis Lead-free

作者: Tian Wanchun Wu Qin Zhou Liang

作者单位: Reliability Research and Analysis Center CEPREI LABORATORY Guangzhou,P.R.China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 284-287

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）