Research on Key Process Technology of RDL-first Fan-out Wafer Level Packaging

摘要：

　　Traditional fan-out wafer level packaging(FOWLP)technology has lower yields and lower levels of reliability due to RDL delamination,chip offset and wafer warpage.This paper studies a new RDL-first fan-out wafer level packaging technology,which overcomes the challenges of traditional FOWLP technology,and extends FOWLP technology to multi-chip and high I/O counts microsystem packaging application.In RDL-First Fan-out WLP process,RDL manufacturing technology,Wafer Level Molding technology,C2W technology and laser de-bonding technology are the important key technologies.The main materials and key technologies process parameter are optimized and fabricated samples of multi-chip fan-out package with 2 layers RDL of line width/spacing of 10μm/10μm.Multi-chip package samples were passed JEDEC component level test MST L1 & MST L3 and 30 drops of board level drop test.

关键词： RDL-first Fan-out WLP C2W Laser de-bonding

作者: Jiachang Zhu Xuefei Ming Xin Yao

作者单位: Center of Microsystems CETC 58 WuXi,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 309-313

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）