Study of capillary tip states on the reliability of Al wire bonding in microelectronic package
In this paper the bonding effect of thin Al wire was investigated with different states of capillary tip.Simulation method was used to provide the cloud map for stress distribution in the bonding process.Optical microscopy(OM)and scanning electron microscopy(SEM)were used to study the structures of pad interface and capillary tip at different states.Energy dispersive spectrometer(EDS)was used to investigate the composition of the capillary tip and pad interface.When the state of capillary tip changed slightly,the simulating results interestingly showed that there was a great difference for thin Al wire bonding at the action point of stress.The position of the strain was amazingly altered from the heel to the neck as well as the degree of tensile force.The model of force was correlated to the experimentally determined.Pull test was used for confirming the simulating results.Although the value of tensile force(~60 gf)was the same,the position of cracking and variance was dissimilar.The experimental and simulation results were in good conformity and can be extended for related improvements of package design.
Al wire capillary tip simulating method pull test
Dezhi Su Dan Zhao Quanwen Wang Changcheng Wang Yucheng Niu Peijie Guan
Shandong Institute of Space Electronic Technology Yan Tai,China
国际会议
上海
英文
343-346
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）