Random Vibration Simulation on Electronic Equipment with Micro-systems by Using the Substructure Method
With the rapid development of high-integrated packaging technology,micro-systems such as SiP(System in Package)and SoC(System on Chip)have been gradually used in aerospace electronic equipment.Meanwhile,because the micro-systems are usually complex in structure and important in function,their mechanical reliability has always been paid attention.Since the random vibration and transient shock load are particularly obvious during the spacecraft launching process,design in the structure and technique of micro-systems has become an important influencing factor for the mechanical reliability of aerospace electronic equipment and hence has been widely concerned.Currently,it has become an efficient method to carry out mechanical reliability analysis and identify the weakness of the structure on electronic equipment by simulation.However,if the entire model is meshed by using the traditional method,total elements and nodes will be huge since the mesh size of micro-system part(including leads and solder joints)is too small,inducing that the duration of calculation cant be guaranteed.In this paper,the substructure method is applied to simulate and analyze the electronic equipment under random vibration conditions,to mainly study the mechanical reliability of the SiP micro-system structure and solve the contradiction between the accuracy and efficiency of the simulation calculation.Finally,it is shown that the simulation results obtained by using substructure method are consistent with the experimental ones,which indicates that the method is effective for analyzing the mechanical reliability of electronic equipment with complicated components.
random vibration simulation electronic equipment micro systems substructure method
Yu Fang Zhang Ning Li Jun Zhao Lan
Development Center of On-Board Computer and Electronics Beijing Institute of Control Engineering Beijing,China
国际会议
上海
英文
351-355
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）