Tin nanoparticles modified nano-silver paste for pressureless low-temperature sintering process

摘要：

　　Silver nanoparticles(Ag-NPs)with the average size of 9 nm and tin nanoparticles(Sn-NPs)with the average size of 30 nm were synthesized via chemical reduction in aqueous solutions,respectively.Then,a novel nano-sliver paste modified by tin nanoparticles(NSP-TNP)was developed and the influences of Sn-NPs content,sintering time and temperature on bonding strength of NSP-TNP joints were studied.After sintering the nano-silver paste modified by 3 wt.%Sn-NPs at 206 ℃ for 30 min without externally applied pressure,the bonding strength of sintered NSP-TNP joints reaches 34 MPa.The enhanced mechanical strength of the sintered NSP-TNP joints is owing to the denser structure and solid-solution strengthening when Sn-NPs were added to the nano-silver paste.The NSP-TNP is promising to be used in power semiconductor(e.g.,SiC)packaging due to some advantages such as higher bonding strength,lower processing temperature and reduced cost.

关键词： Tin nanoparticle Nano-silver paste Solid-solution strengthening Pressureless low-temperature sintering

作者: Qi-Wang Chen Xiao Ma Hai-Jun Huang Can Yin Min-Bo Zhou Xin-Ping Zhang

作者单位: Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering,and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,South China University of Technology,Guangzhou 510640,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 356-360

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）