Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration
A single-layered TSV structure model without micro-bump joints and a three-layered TSV structure model with micro-bump joints were constructed to simulate the changes of Cu plastic deformation regions and Cu protrusion of Cu-filled TSVs under different thermal cycling conditions,by means of finite element(FE)simulation.On the basis of strain energy theory,the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints were investigated.The simulation results manifest that under the thermal cycling with peak temperature 125 ℃,the plastic deformation regions mainly locate in Cu pads,while spreading to Cu fillers under the thermal cycling with peak temperature 175 ℃,and Cu protrusion height increases with increasing peak temperature.Significantly,it is found that the increase in Cu protrusion leads to the decrease in thermal fatigue life of micro-bump joints.
Cu-filled TSV Cu protrusion micro-bump joint thermal fatigue finite element simulation
Jie-Ying Zhou Cheng Wei Shui-Bao Liang Han Jiang Xiao Ma Xin-Ping Zhang
Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering,and Guangzhou Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,South China University of Technology,Guangzhou 510640,China
国际会议
上海
英文
361-366
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）