Investigation on solid state bonding and intermetallic compounds reaction of Cu pillar bump/Ni micro cones
Copper pillar bump,with its feasibility for the ultra-fine-pitch interconnection,have become the mainstream form of advanced packaging.Studies on the copper pillar bump bonding method and intermetallic compounds(IMCs)growth as well as its reliability become the hot spot of the industry.Here we developed a low temperature solid state bonding method for 25 μm-diameter copper pillar bump with Sn cap and Ni micro cones.The optimal bonding parameters include 200℃ bonding temperature,12.2MPa bonding pressure and 300s load hold time.150℃ isothermal aging treatment has been conducted after bonding to simulate the heat effect of electronic products during service.By measuring the thickness of the IMC,the diffusion coefficient of Cu3Sn has been obtained.In addition,Kirkendall voids has been observed during aging process.
Cu pillar bump Ni micro cone solid state bonding intermetallic compounds
Yukun Guo Anmin Hu Ming Li
State Key Laboratory of Metal Matrix Composites,School of Materials Science and Engineering Shanghai Jiao Tong University Shanghai,China
国际会议
上海
英文
419-422
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）