Reliabilities and Failure Analysis of Printed Circuit Boards Interconnect Stress Test

摘要：

　　Interconnect Stress Testing is currently being used more and more in PCB industries.It is an accelerated aging method providing vivid insight into plated through holes reliability of high performance boards.The test data analysis provides a detailed understanding of PTH life during assembly and/or rework.The testing mechanism of IST,test coupons and test methods are detailed in this paper,and analysis after IST failure is discussed.

关键词： IST coupon PTH via

作者: Ying Yang

作者单位: Reliability Research and Analysis Center China CEPREI Laboratory Guangzhou,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 428-431

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）