Effects of Sb addition on the microstructure and mechanical performance of Sn58Bi based alloys and the solder joints

摘要：

　　The influences of Sb alloying on the microstructure and properties of Sn58Bi based solders,and on the mechanical performance and fracture behavior of Sn58Bi–xSb/Cu joints were investigated.Results show that the Sb addition can refine β-Sn phase of Sn58Bi alloy mainly by forming SbSn intermetallic compound(IMC),thus has refinement effect on the solder matrix.In addition,Sn58Bi–xSb alloys consist of Bi-rich phase,β-Sn phase as well as SbSn IMC phase.Although the Sb-containing solders exhibit slightly lower tensile strength than Sn58Bi alloy,the ductility of Sn58Bi–xSb solders is improved evidently due to the refined microstructure.Moreover,the shear strength of Sn58Bi–xSb/Cu joints increases with increasing Sb content due to the Sb alloying strengthening effects and the refinement strengthening resulted from the fine precipitated SbSn IMC,except for Sn58Bi–1.5Sb/Cu and Sn58Bi–2.0Sb/Cu joints.Furthermore,the fracture mode of Sn58Bi–xSb/Cu joints changes from the ductile fracture in the solder to the partially ductile and brittle fracture either in the solder or in IMC layer,when the Sb content exceeds 1.0%.

关键词： Sn-Bi solder Sb alloying Microstructure Solder joint Mechanical property

作者: Jin-Gang Li Xiao Ma Min-Bo Zhou Xiang Ning Xin-Ping Zhang

作者单位: Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering,and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,South China University of Technology,Guangzhou 510640,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 457-461

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）