Material and structural optimization of fatigue life of PBGA under temperature cycling
Working environment of electronic chips has the characteristics of temperature cycling.This paper establishes a three-dimensional finite element model for coupled thermal-mechanical analysis in ABAQUS to simulate the deformation behavior of solder joints in the plastic ball grid array(PBGA)package under temperature cycling.The cyclic temperature is from 20℃ to 125℃ with the ramping rate of 105℃/0.2 analysis time and the dwell temperature is 20℃ and 125℃.The constitutive models of the incorporated materials especially for Sn-3.0Ag-0.5Cu(SAC305)solder are assigned directly in the 3D FE model,which are scaled according to the applied temperature using the available experiment data in the literature.Furthermore,a modified Coffin-Manson equation is used to establish a fatigue model based on the shear plastic strain.By varying the important factors such as the solder joint height,temperature ramping rate,coefficient of thermal expansion of solder joint and offset distance,the corresponding effect on the fatigue life of the solder joint under thermal cycling is numerically investigated.After comparing the various parameters of the PBGA package,some suggestions are made to emphasize the optimal combination of material properties and structural dimensions.
PBGA thermal cycling fatigue life solder joint
Wenjie Wang Yao Yao Xu Long Zhenghu Zhu
School of Mechanics,and Civil Engineering and Architecture Northwestern Polytechnical University Xi No.8511 Research Institute China Aerospace Science and Industry Corporation Nanjing,China
国际会议
上海
英文
477-481
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）