Preparation of a low temperature sintering silver nanoparticle ink and fabrication of conductive patterns on PET substrate
A low temperature sinterable conductive ink was prepared using silver nanoparticles(Ag NPs)as filler material.The polydisperse Ag NPs with diameters of 5–85 nm were synthesized using polyacrylic acid(PAA)as stabilizer.The sintering temperature of the Ag NPs can be lowered from conventionally used 200 ℃ to 80 ℃ in the presence of chloride.The silver ink with metal loading of 47 wt.%was successfully printed on poly ethylene terephthalate(PET)substrate through screen printing technique.The resistivity of the silver film is 1.52 × 10-7 Ω·m after sintering at 120 ℃ for 1 h.Finally,highly conductive patterns on PET substrate for flexible electronics application were fabricated.
silver nanoparticle conductive ink flexible electronics low temperature sintering
Hai-Jun Huang Min-Bo Zhou Can Yin Qi-Wang Chen Xin-Ping Zhang
Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering,and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,South China University of Technology,Guangzhou 510640,China
国际会议
上海
英文
482-485
2018-08-08(万方平台首次上网日期,不代表论文的发表时间)