Fabrication of oxidation-resistant submicron copper particles and the conductive ink as well as its sintering behavior on the flexible substrate

摘要：

　　The submicron copper particles with a mean diameter of 197 nm were obtained using lactic acid as stabilizer and sodium hypophosphite as a mild reducing agent.The obtained Cu particles show a good oxidation resistance owing to the weak reducibility of lactic acid.The screen printable copper ink with a metal loading of 50 wt.%was prepared using the obtained copper particles.The copper films after sintering at 150 ℃ for 1 h in nitrogen atmosphere exhibit a relatively low resistivity of 1.87 × 10-4 Ω·m.The conductive copper film circuits were successfully fabricated on flexible polyimide(PI)substrate,with which an LED can be lighted up easily.

关键词： submicron copper particle conductive ink flexible electronics sintering behavior

作者: Hai-Jun Huang Min-Bo Zhou Can Yin Qi-Wang Chen Xin-Ping Zhang

作者单位: Lab of Smart Materials and Electronic Packaging,School of Materials Science and Engineering,and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,South China University of Technology,Guangzhou 510640,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 491-495

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）