Research on heat dissipation of a new rectangular microchannel structure based on thermal bimetal

摘要：

　　With the shrinkage of package size and the increasement of the integration,the heat dissipation in the electronics package deteriorates.Microchannel technology therefore becomes one of the most active areas of research in thermal management.This paper investigated the impact of local deformation structure in a rectangular microchannel on heat dissipation performance,and a solution was proposed by introducing thermal bimetal to the rectangular microchannel.The thermal bimetal was designed to contact with the heat source through thermal columns,and the deformation of thermal bimetal regulates the flow velocity of local cooling fluid in microchannel to achieve self-adapted heat dissipation management.The results indicated that the concave thermal bimetal rectangular microchannel outperformed than the ordinary microchannel due to its lower average temperature and lower temperature difference,therefore kept the heat source chip(e.g.PA)at a lower temperature.These efforts could be helpful for the design and optimization in microchannel cooling system for high power chip packaging.

关键词： Rectangular microchannel Thermal bimetal Heat dissipation Deformation High power chip packaging

作者: Weikang Wan Haihua Li Qidong Wang Xiaoxin Liang

作者单位: Institute of Microelectronics of Chinese Academy of Sciences National Center for Advanced Packaging( Institute of Microelectronics of Chinese Academy of Sciences University of Chinese Academy of Scienc

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 517-520

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）