A Modified MEMS-Casting Based TSV Filling Method with Universal Nozzle Piece That Uses Surface Trenches as Nozzles

摘要：

　　Through-Silicon Via(TSV)is an ever-important interconnection technology for advanced packaging.Via-filling is the most critical and costly process in the whole TSV fabrication.In this paper,we present a modified MEMS-casting TSV filling method that uses a nozzle piece,on which surface KOH etched trenches are employed as nozzles.By this improved method,a universal nozzle can be used for TSV arrays with different diameters.TSV arrays with diameters from 20μm to 300μm have been demonstrated.

关键词： TSV Interconnection MEMS Alloy

作者: Jiebin Gu Xiaoyuan Xia Weibo Zhang Xinxin Li

作者单位: State Key Laboratory of Transducer Technology Shanghai Institute of Microsystem and Information Technology Shanghai,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 536-539

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）