Effect of some N-heterocyclic inhibitors in the soldering flux on the corrosion behavior of eutectic Sn-58Bi alloy and its solder paste

摘要：

　　The influenceof some N-heterocyclic inhibitorson the corrosion behavior of Sn–58Bialloy and powders in the soldering fluxwasinvestigated usingelectrochemical impedance spectroscopy(EIS),weightloss experimentand scanning electron microscopy(SEM).Results showthat the piperidine-based inhibitor(P-1)actsasa goodinhibitoron the corrosionof Sn–58Bisolder alloyand powders in the soldering flux.The inhibition efficiency(IE)improves with the increase in P-1concentration.P-1inhibitoralsoshowshigh protection efficiency forSn–58Bialloycorrosionin acid mediumwhen the contentof the organic acid increases from 2 wt.%to 6wt.%.The SEM analysisresults manifestthat theSn-rich phase of Sn–58Bi solderalloy ispreferentiallyetched and greatlydissolved in the soldering flux without any inhibitorduring immersion,and the additionofP-1inhibitorcan reduce the corrosion processsignificantly.

关键词： Sn-58Bi solder corrosion behavior corrosion inhibitor soldering flux electrochemical impedance spectroscopy

作者: Xiang Ning Min-Bo Zhou Jin-Gang Li Xin-Ping Zhang

作者单位: Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering,and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,South China University of Technology,Guangzhou 510640,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 540-545

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）