Plastic deformation behavior of IMCs in solder joints during nanoindentation

摘要：

　　Electronic packaging technology is widely used.The relaibility of electronic packaging is closely related to solder joint.Among many possible factors,IMC plays a vital role in the mechanical integrity of precise solder joints.So,it is essential to clarify mechanical properties of IMCs.In this paper,Nanoindentation and Abaqus were employed to characterise the deformation behaviour of Cu6Sn5 and Cu3Sn.In contrast to conventional mechanical tests on solder joints,IMCs was found to be able to deform plastically.Elastoplastic deformation behaviour of IMCs was also studied by verifying experimental results from those two methods.There was 52%and 63%of plastic work involved in the nanoindentation tests of Cu6Sn5 and Cu3Sn respectively.The preliminary study shows that the power-exponential equation model is more suitable for the actual deformation of IMCs.

关键词： Solder joints Plastic deformation Nanoindentation FEM

作者: Fan Yang Sheng Liu Li Liu Zhiwen Chen

作者单位: The Institute of Technological Sciences Wuhan University Wuhan,Peoples Republic of China 430072 School of Materials Science and Engineering Wuhan University of Technology Wuhan,Peoples Republic o

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 556-561

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）