Shear creep and fracture behavior of micro-scale BGA structured Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads
Shear creep performance and fracture of BGA structured Cu/Sn-3.0Ag-0.5Cu(SAC305)/Cu joints under coupled electrical load,thermal load and mechanical shear load were studied.The current stressing imposed on the mechanical shear stress does not change the basic feature of creep strain curves of the joints.The shear creep strain rate of solder joints is increased by electric current stressing.In addition,compared with the joints without electric current stressing,creep activation energy and stress exponent at a current density of 6 ×103A/cm2increase from 69.2 kJ/mol to 90.8 kJ/mol and5.3 to 11.4,respectively,which indicates that lattice diffusion may become the dominant creep mechanism.Moreover,the imposed current on the joint causes a shift of fracture location from the solder matrix to the region near the interface between the solder and intermetallic compound(IMC),and correspondingly the fracture mode turns to the mixed ductile-brittle fracture.
electro-thermo-mechanical coupled loads BGA joint shear creep fracture behavior electric current stressing
Wen-Kai Le Zhi-Wei Zhu Shanshan Cao Xin-Ping Zhang
Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering,and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,South China University of Technology,Guangzhou 510640,China
国际会议
上海
英文
620-624
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）