Low interconnection loss and low-cost approach for Antenna in Package of 77GHz Automotive Radar applications

摘要：

　　This work provides a low-cost Antenna in package(AiP)implemented on a Advanced single sided substrates(aS3 package)for 77 GHz automotive radar applications.This work demonstrates firstly the 77GHz losses of the transition from chip to package among flip-chip ball grid array(FCBGA)package,flip chip chip scale(FCCSP)package,Fan-out WLP,and aS3 package.Although Fan-out WLP can minimizes 77-GHz losses of transition from chip to package plus package to PCB,low-cost solutions for 77 GHz AiP are importance opportunity for automotive radar applications.The provided AiP solution on aS3 package has low losses of transition from chip to package and the performance meets the requirements of 77 GHz automotive radar systems.aS3 package uses low-cost substrate and lower cost assembly process than Fan-out WLP.This work proposes a low-cost 77GHz AiP solution,and it is suitable for automotive radar applications.

关键词： 77 GHz automotive radar systems flip-chip ball grid array (FCBGA) package flip chip chip scale (FCCSP) package Fan out wafer level chip scale package (Fan-out WLP) Advanced single sided substrates (aS3 package) Antenna in package (AiP)

作者: Cheng-Yu Ho Chen-Chao Wang Sheng-Chi Hsieh Chun-Yen Ting

作者单位: Electrical Laboratory,Corporation Design Division,Corporate Research and Development,Advanced Semiconductor Engineering(ASE)Group,Inc.,No.26,Chin 3rd Road Nantze Export Processing Kaohsiung 811,Taiwan,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 629-632

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）