Study of the curing kinetics and heat resistance of isotropic conductive adhesive
In this study,the curing kinetic models of a self-made isotropic conductive adhesive(ICA)and the corresponding unfilled matrix resin were established and the relationships among glass transition temperature(Tg),curing time and temperature were obtained with their individual DiBenedetto equations,which enables the design of the curing process of ICA with the expected heat resistance performance.An autocatalyzed kinetic model was used to describe the curing reaction and the kinetic parameters were determined through the thermal data obtained by differential scanning calorimeter(DSC)under isothermal conditions.The activation energy values for the curing reaction of the ICA and the unfilled matrix resin were determined to be 68.1 kJ/mol and 72.9 kJ/mol respectively,which means the curing process of ICA takes place relatively easier.The as-obtained and calculated data of the curing behavior were compared to verify the accuracy of the established equations and it shows a good consistency.The addition of micron-scale silver flakes does not change the curing mechanisms very much.Finally,time-temperature profile can be calculated for any Tg required through the curing kinetic model and the DiBenedetto equation.
isotropic conductive adhesive curing kinetics glass transition temperature curing process
Han Jiang Min-Bo Zhou Xin-Ping Zhang
Lab of Smart Materials and Electronic Packaging in School of Materials Science and Engineering,and Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials and Reliability,South China University of Technology,Guangzhou 510640,China
国际会议
上海
英文
633-637
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）