The application and case study of FIB system in the PCB with OSP final finish failure analysis

摘要：

　　The two traditional methods to measure the thickness of OSP final finish are introduced in this paper.The advantages and the disadvantages of these methods are also briefly discussed.Then according to the working principle,this paper focuses on introducing the convenient methods of FIB to measure the thickness of OSP final finish.By means of poor wettability failure case study,the advantage of the innovation method compared to the traditional methods is introduced in this paper.And the study will present an innovative idea for poor wettability failure analysis on the OSP final finish PCB.

关键词： FIB Failure analysis OSP thickness measurement wettability

作者: Jianghua Shen Xiao He Enliang Li

作者单位: Reliability Research and Analysis Center(RAC)China Electronic Product Reliability and Environmental Testing Institute(CEPREI)Guangzhou,510610,P.R.China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 638-641

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）