Fluxless Bump Reflow in Activated Hydrogen Atmosphere

摘要：

　　A novel hydrogen activation technology based on electron attachment(EA)is developed for fluxless reflow or soldering at ambient pressure and normal soldering temperature.The technology can be used for many areas of the electronics packaging industry,such as for wafer bump reflow especially ultra-fine bumps of at or near single-digit micrometers and without negative effects on circuit functionality.

关键词： fluxless Activated hydrogen wafer bump reflow

作者: C.Christine Dong Fisher Yu Tim Bao Wenqi Zhang Fengwei Dai Dengfen Yang

作者单位: R&D department Air Products and Chemicals,Inc.Allentown,PA,USA R&D department Air Products and Chemicals,Inc.Shanghai,P.R.China R&D Department National Center for Advanced Packaging Co.,Ltd.(NCAP)Wuxi,Jiangsu Province,P.R.China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 652-655

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）