Reliability Improvement of CBGA Solder Ball Joint in LTCC-based SiP Module
Due to its multi-layer flexible layout,embedded passive integration and excellent airtightness,LTCC(Low Temperature Co-fired Ceramic)based SiP modules had been widely used in Electronic products.However,solder balls encountered large stresses because of the inherent mismatch of the coefficient of thermal expansion(CTE)between a large ceramic ball grid array(CBGA)and a glass-epoxy printed circuit board(PCB).In this paper,construction of CBGA on LTCC-based SiP module had been investigated through experimentation and physics of failure analysis based on the reliability point of view.3D finite element analysis(FEA)models were developed to understand the thermo-mechanical behavior of CBGA under thermal cycling test.In addition,a daisy chain design was used to monitoring the resist changes of solder ball joints during thermal cycling tests while red dye penetration tests were also carried out to confirming the failure mode of interconnect solder joints.To ease the stress and strain sufferings,solder ball materials,ball size,pad diameters and dimensions of LTCC substrate were taken into considerations to finally confirm an optimal BGA packaging structure.
LTCC thermal cycling finite element reliability improvement
Yangyang Li Yuanqi Zeng Dong Dong Hui Wang Jiyong Tan Jifan Zhang
Microsystem Integration and Manufacture Center The 29th Research Institute of China Electronics Tech Microsystem Research and Development Center The 29th Research Institute of China Electronics Technol
国际会议
上海
英文
656-661
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）