Research on the thermal fatigue life of CQFN packaging
With Ceramic Quad Flat No-lead packaging structure as the research object,using finite element method on the distribution of stress and strain in the temperature cycle test simulation analysis,analyzed the thickness of the printed circuit board,the size of the Ceramic package,the form of the lead and the range of temperature change on the influence of solder joints reliability.Based on the simulation results,the fatigue life of CQFN packaging structure under temperature cyclic loading is calculated.Results show that by increasing the thickness of the PCB,reasonable selection of Ceramic package size and lead form and try to reduce the temperature change range,can effectively improve the thermal fatigue life of solder joint.It provides a reliable theoretical basis for the design of this kind of packaging structure.The problem such as the failure of welding spot after installation on PCB is avoided due to the unreasonable design of the structure.Reasonable structural design plays an important role in solving the failure problems in reliability test and improving the reliability of the device.
CQFN packaging structure Thermal fatigue life Temperature cycle test Finite element method
Zhen-tao Yang Bo Peng Ling Gao
The 13th Research Institute China Electronics Technology Group Corporation Shijiazhuang,China
国际会议
上海
英文
662-666
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）