Effect of Pretreatment on Copper Filling of High Aspect Ratio Through-Silicon Via(TSV)

摘要：

　　Ultrasound and vacuum pretreatment with pure water as prewetting solution could achieve good wetting effect,not only improving the filling quality but filling rate as well.In this paper,we studied the effects of pretreatment with SPS(Na2(SO3(CH2)3S)2))as prewetting solution on the filling processes in three commercial bath systems.By means of LSV and EIS,we analyzed the functional mechanism of the SPS in the pretreatment.According to the electrochemical test results,electroplating experiments were further carried out under different current densities to analyze the filling process and finally put forward a feasible proposal to optimize the proportion of additives and the electric parameters used in the void-free electro deposition.

关键词： 3D integration TSV filling pretreatment electrodeposition

作者: Hongfa Pan Yumei Zhang Ming Li Liming Gao

作者单位: School of Materials Science and Engineering Shanghai Jiao Tong University Shanghai,200240,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 672-675

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）