An effective way to solve the void problem of traditional underfill based on NCP technology

摘要：

　　High I/O density,short interconnect lines,self aligned mounting,good heat dissipation,and small assembly area make flip chip packaging become one of the most attractive technologies for contemporary electronic packaging.As the chip size increases,the gap between the chip and the substrate and the pitch of the solder connection point decrease,non-uniform voids will be produced in the conventional flip chip underfilling process.In this study,the problem of high density flip-chip underfilling is studied.NCP thermocompression bonding is used to solve the void problem that occurs in the traditional under-filling process.Voids in the underfilling process can be effectively eliminated by optimizing the process condition for NCP thermocompression bonding.

关键词： Flip chip Underfill NCP Thermocompression bonding

作者: Guoheng Liu Jianrui Xue Liming Gao Ming Li

作者单位: Jiangyin Changdian Advanced Packaging Co.,Ltd.Jiangsu,China School of Material Science and Engineering Shanghai Jiao Tong University Shanghai,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 687-690

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）