Effect of Crystal Boundary Character and Crystal Orientation on Electromigration in Lead-free Solder Interconnects with Cyclic Twinning Structure

摘要：

　　This study mainly examined the intermetallic compounds(IMC)migration path in flip-chip(FC)solder bump with cyclic twinning structure under current stressing.Long grain boundary was formed across the bump because of the twinning structure.If the orientation of the long crystal boundary was nearly aligned to the electron flow,IMCs migrated largely from the cathode to the anode along the long crystal boundary.Oppositely,if the orientation of the long crystal boundary was roughly normal to the electron flow orientation,it was the crystal orientation on each side of the long crystal boundary that determined the migration path of IMC.

关键词： solder electromigration crystal orientation electron backscattered diffraction cyclic twinning

作者: Xing Fu Hongtao Chen Bin Zhou Si Chen Ruohe Yao Xiaoqi He

作者单位: Science and technology on reliability physics and application of electronic component laboratory Gua Shenzhen Graduate School,Harbin Institute of Technology Shenzhen,China School of Electronics and Information South China University of Technology Guangzhou,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 701-703

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）