Failure analysis and case study of wire bonding

摘要：

　　Wire bonding is one of the most important processes in electronics packaging,and it is reliable and low cost comparing to the other interconnection process.The wire bonding process influences the reliability and the cost of integrated circuit and device directly,and it was irreparable for plastic package component.In this paper,some wire bonding failure case was studied and the failure mechanism was discussed.Finally,some measures should be taken to minimize such failures.

关键词： wire bonding reliability failure analysis

作者: Lili Ma Hang Chen

作者单位: Reliability Research and Analysis Center Ceprei Laboratory Guangzhou,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 728-730

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）