Effects of nano-SiO2 additions on wettability and interfacial IMC growth of SAC solder on Ni-xSiO2 composite electroless clad layer
This paper prepares the Ni-SiO2 composite barrier layer containing different concentration of SiO2 nanoparticles(0g/L,3g/L,6g/L and 9g/L respectively).Moreover,it investigates the different concentration effects on the wettability of ternary eutectic Sn-Ag-Cu(SAC)solder on the Ni layer and the growth of interfacial intermetallic compounds(IMC)between the Sn-Ag-Cu solder and the composite coating.In this study,the Ni-xSiO2 composite barrier layers with different concentration of SiO2 nanoparticles were deposited on the surface of pure Cu plate by chemical plating technique.The max wetting Force(Fmax/mN)of SAC solder on the Ni-xSiO2 surface,microstructure and the IMC growth of solder/Ni-xSiO2 composite interface under different aging time at 170℃ were discussed.In comparison with the Ni barrier without SiO2,the wettability of SAC solder on the Ni-xSiO2 surface will increase evidently.Cross-section studies indicate that added SiO2 nanoparticles can inhibit interfacial IMC growth effectively.
SiO2 nanoparticles Ni barrier layer Wettability Intermetallic compound Aging
Yong Wang Xiaochen Xie Ying Liu Xiuchen Zhao
Beijing Microelectronic Technology Institute Beijing,P.R.China College of Materials Science Beijing Institute of Technology Beijing,P.R.China
国际会议
上海
英文
753-756
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）