Effect of Chip Layout in Wafer on Molding and Fan-Out Wafer Level Packaging(FO-WLP)Technology
Fan-out wafer-level packaging(FO-WLP)technology including molding and RDL process is attracting more and more attention due to its low cost,high performance and flexibility.But for the Die-First process,the wafer warpage and expansion in process are always the most critical keys to FO-WLP technology,which will affect the RDL accuracy.In this paper,the influence of chip layout in 12 wafer on warpage and expansion was studied by simulation and experiment.The warpage includes two aspects: the first in molding and the second in RDL process.The expansion was mainly due to RDL process.Chip layout has great influence on warpage and expansion when the chip thickness and the wafer thickness were fixed.Through the research of four typical layouts,we found the rules and gave some useful suggestions about layout.
FO-WLP Chip layout Molding Warpage Shift
Yang Li Xuefei Ming Yong Ji Xin Wu Nayan Gao Bo Wang
Center of Microsystems CETC 58 WuXi,China Dept.Packaging CETC 58 WuXi,China
国际会议
上海
英文
757-760
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）