Leveraging 3D Packaging Technology to Enhance Integrated Circuits Security and Reliability
Hardware security plays an important role in the information security field and has gained significant interests from both industry and academic communities.3D integration technology,which enables ICs to be stacked in the vertical dimension and provides smaller form factor and higher performance,has been extensively researched in the past.From the security and reliability perspectives,3D integration technology also provides a unique perspective to cope with the security threats occurred in different phases of an ICs life cycle.In this paper,the advantages and challenges of 3D integration technology have been analyzed from security and reliability perspectives.Furthermore,a novel low cost wet etching based interposer structure was introduced to realize high security packaging of ICs,which owns package level metal shielding network to prevent side channel information leakage and to detect reverse-engineering attack in real time.The thermal and electromagnetic properties of the designed package structure were examined by finite element method and the fabrication process was also systematically discussed.
3D integration Hardware Security Reliability
Chunsheng Zhu Yingjian Yan Pengfei Guo Junwei Li
Institute of Information Science and Technology Zhengzhou,China
国际会议
上海
英文
766-769
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）