Packaging flat micro heat pipe using low melting point alloy

摘要：

　　Heat pipe based coolers and substrates can spread heat in high efficiency,thus it is widely used in thermal management of the high power electronic devices.The critical issue in fabrication of the flat micro heat pipe(FMHP)is working fluid charge and sealing.Using low melting point alloy(LMPA)to charge and sealing FMHP is presented in this paper.The layout of the charging grooves of FMHP is shown in this paper,the sealing grooves on the silicon substrate and the glass cover plate are discontinuous,but after anodic bonding,channeled through the silicon wafer and glass plate,the grooves are connected to the working area of the FMHP.The detailed charging steps are described in the paper as well.After the working fluid charged,the FMHP keeps a flat contour,which benefits its usage in compacted application.This charge and sealing methods also provide a feasible way to charge a non-metal heat pipe without employ epoxy glue,thus reduced spontaneously leak the non-condensable gas into the working part of the FMHP and promote it performance.

关键词： flat micro heat pipe packaging low melting point alloy working fluid charge

作者: Yi LUO Chen JIA Congming LI Xiaodong WANG

作者单位: Key Laboratory for Micro/Nano Technology and System of Liaoning Province Dalian University of Technology Dalian,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 770-773

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）