Case study of SBD burnout failure caused by non electric overstress
The most common failure mode of Schottky diode is short circuit,and the users generally think that it is caused by the EOS to check the circuit design and whether there is an abnormal overelectric stress in the actual use of the circuit.In this paper,through the destructive physical analysis of the short circuited samples returned from the whole end of the market,the microscopic features of the failure parts are obtained.The electrochemical migration of the silver materials of the internal chip electrode has been found in the analysis of the device structure,manufacturing technology,working principle and failure background.A leakage channel is formed,and the local hot spot is formed at the edge of the chip,resulting in the breakdown of the chip and the burning of short circuit.
SBD burnout Electrochemical migration of silver hotspot
Guangning Xu Jian zhou
Reliability Research and Analysis Center China Electronic Product Reliability and Environmental Testing Research Institute(CEPREI)Guangzhou,China
国际会议
上海
英文
791-794
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）