Effect of Different Material Systems on Interconnection Properties of 30μm Pitch Micro Bumps

摘要：

　　as the copper pillar bumps with fine pitch and high density were widely applied in high density interconnections packaging.Its increasingly important to study the interconnection technology of high density micro bumps interconnection.In the paper,we designed Test Vehicle of copper pillar bumps with different material systems for verifying the bonding effect between copper pillar bumps.We compared the bonding experiments of micro bumps structures of three different materials.Finally,the resistance value of a single micro bump bonding structure can be obtained by testing the kelvin structure.Moreover,the test results can be verified by theoretical calculation.

关键词： micro bumps interconnection fine pitch different material systems

作者: Fengwei Dai David Wei Zhang Wenqi Zhang Guojun Wang Dengfeng Yang Lin Chen Liqiang Cao

作者单位: School of Microelectronics,Fudan University,Shanghai,China,200433;Institute of microelectronics of C School of Microelectronics,Fudan University,Shanghai,China,200433 The National Center for Advanced Packaging,Wuxi,China,214135 Institute of microelectronics of Chinese academy of sciences,Beijing,China 100029;The National Cente

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 828-831

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）