3D Module in Fan-out Packaging

摘要：

　　The paper presents the design of a novel 3D module by utilizing Fan-out packaging technology.The proposed module consists of bypassing capacitors,power supply management chips,and RF vertical interconnection structure.The design features the advantages of compact size and good performance,as the module doesnt require additional area when it is located above the layer of the active circuits and provides the function of RF signal transmission with low loss.

关键词： RDL fan-out

作者: Lihua Zhan Hao Li Fuguo Zhu Zhipeng Zhou

作者单位: Science and Technology on Antenna and Microwave Laboratory The 14th Research Institute,CETC Nanjing, Microsystem Department The 14th Research Institute,CETC Nanjing,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 832-833

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）