A highly reliable cleaning process
Soldering is an important process for the production of electronic products.For high-reliability electronic products,various types of pollutants introduced after soldering are unacceptable and must be cleaned to meet their use requirements.With the increase of product assembly density and the wide application of bottom-side soldered components such as BGA,cleaning has become more and more difficult.This article mainly introduces a highly reliable cleaning process-vacuum vapor phase cleaning.The use of vacuum enhances the cleaning ability for fine pitch,invisible bottom surface,and satisfies the cleaning requirements for high density and high reliability electronic products.
Vacuum Vapor Cleaning Electronic Products Soldering Pollution High Density High Reliability
ZHANG Jun Ye Xiao Fei SHI Hailin
Xian Microelectronics Technology Institute Xian China 710119
国际会议
上海
英文
834-839
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）